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Specialists of laser processing for semiconductor, MEMS, LCD, LED etc. |
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Laser Systems Inc. > PRODUCT > Laser Processing Equipment
Laser Processing Equipment
LaS is developing and providng "Optical Engine", each comprises a laser souce, an optimized optical setup, some necessary supportive functions, for laser scribing machine, laser dicing machine, laser marking machine, etc as OEM product. Also, LaS is working on technical development of laser processing for various materials; Sapphire, SiC: Silicon Carbide, GaN: Gallium Nitride, Si, LCD glass panel, etc.
* This is for information purpose only and does not set forth any warranty. The specifications are subject to change without notice.
Laser Scribing Machine: TEC-6018LT
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Prevent device performance degradation
In scribing process of LED chips, for example, TEC-6018LT enables to prevent luminosity down which has been a bottle neck of conventional laser scribers by LaS proprietary optical setup.
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Auto-focus function
TEC-6018LT resolves processing instability coming from nonuniformity of wafer thickness.
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Auto-alignment function
Wafer position/ direction is automatically and quickly aligned by a proprietary image recognition system. Possible to align a broken piece of wafer with no alignment mark.
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Laser power stabilizer
TEC-6018LT constantly monitors the present laser power and keeps it stable for excellent processing performance by LaS proprietary automatic feedback control system.
| Standard Specification* | |
| Wafer size | 3" diam. max |
| Throughput | 8wfs/hr (Typical) |
| Dimensions | W:1248 D:677 H:1500 exc. signal tower [mm] |
| Weight | 800kg |
| Power | Single-phase 30A 200V 50/60Hz |
| Vacuum source | Equipped inside body |
| Compressed air source | 0.5MPa min |
* This is for information purpose only and does not set forth any warranty. The specifications are subject to change without notice.