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Specialists of laser processing for semiconductor, MEMS, LCD, LED etc. |
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Laser Systems Inc. > PRODUCT > Sample Data & Applications
Sample Data & Applications
Scribing of Sapphire wafer
Various shape of grooves are realized by LaS proprietary optical setup.
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| Width: 5um, Depth: 17um Top |
Width: 5um, Depth: 22um Torn face |
Width: 16um, Depth: 14um Cross section of the groove |
Width: 9um, Depth: 70um Cross section of the groove |
Scribing of SiC wafer (Wafer thichness: 400um, Kerf width <10um)
SiC is an ultrahard material which is applied to power devices, LEDs, etc.
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| Top | Torn face | Torn face | Torn face |
High definition marking inside glass
Enables to prevent someone from maliciously changing data because the data is recorded inside the glass (SiO2) layer. Also, it allows you to mark not only "wafer by wafer" but also "chip by chip" due to extremely high definition.
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| Image of "the surface" after marking | Image of "5um inside" after marking |
Surface patterning (dots & grooves)
Well-suited to surface treatment applications targeting to optical or mechanical property changes. Possible to make pattern size down to sub-um scale.
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| Line/ spece/ pitch: 2μm |